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Maxim Introduces First Fully Integrated Active Mixer (11/18/02, 7:25 AM EST) Maxim Integrated Products has introduced the MAX9982, said to be the industry's first fully integrated SiGe active mixer to include an LO switch, LO buffer, and on-chip baluns. This mixer is designed to meet the demanding requirements of today's cellular and GSM900 wireless infrastructure applications. A single IC provides 2 dB of conversion gain, 12 dB of noise figure and 26.8 dBm of IIP3 performance while replacing two amps, two baluns, an LO switch and dozens of discrete components. Through this integration, the overall size of the mixer circuit has been reduced by a factor of 2.5×, and the discrete part count has been slashed in half. In addition, the SiGe device increases production yields while simultaneously providing more ESD reliability than other GaAs alternatives. The MAX9982 is appropriate for 825 MHz to 915 MHz GSM, cdma2000, TDMA, and iDEN base station applications where high linearity and low noise figure are required for receiver designs. Since the device provides more than 2 dB of conversion gain, the designer can eliminate a complete IF amplifier stage within the receiver lineup. Exceptional IIP2 performance of 60 dBm also eases receiver filtering requirements. On-chip RF and LO baluns and built-in matching circuits have been provided to accommodate for single-ended 50 O terminations. GSM frequency hopping is supported with the integrated LO switch; switching speeds of 250 ns are supported with 50 dB of LO-to-LO isolation. The on-board LO buffer provides ±5 dB drive variance control, yielding stable G, NF, and IIP3 performance over temperature, supply, and input power. The device has exemplary gain spread of ±0.6 dB from nominal at room, and 0.0135 dB/°C over temperature. IIP3 spread is ±0.5 dB over temperature. The MAX9982 comes in a 5 mm × 5 mm 20-pin QFN package that is fully qualified for direct PC board mount. 
FeaturesFirst fully integrated SiGe active mixer to include an LO switch, LO buffer, and on-chip baluns. Single IC provides 2 dB of conversion gain, 12 dB of noise figure and 26.8 dBm of IIP3 performance GSM frequency hopping is supported with the integrated LO switch Switching speeds of 250 ns are supported with 50 dB of LO-to-LO isolation. Dimensions: 5 mm × 5 mm Package: 20-pin QFN
Applications825 MHz to 915 MHz GSM, cdma2000, TDMA, and iDEN base station applications E-Insite  
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